Practical Courses

Printed circuit boards, SMD packages, chemistry, soldering process (wave/reflow/selective, L/LF), PCB cleaning, component disassembly/assembly (THT/SMD, L/LF) and PCB repairs (solder pads/plated holes), THT and SMD defects and their causes.

Quality requirements per IPC A-610, repair principles per IPC 7711/7721.

Practical demonstration and independent soldering on digital soldering stations (soldering iron, electronic desoldering pump, thermal tweezers). Programmable hot-air soldering equipment with preheating and camera for continuous temperature profile measurement.

Principles of soft soldering and solder joint formation. Alloys used in soldering processes and their properties. Fluxes and solder pastes – types, applications, requirements. Factors affecting solder joint reliability.

Temperature profiles for wave and reflow soldering. Measuring temperature profiles on wave soldering machines and reflow ovens. Defects in the soldering process and their causes. Practical demonstrations and discussion.

Solderability of component leads and PCBs. Comparison of the effects of different fluxes and solder alloys. Results evaluated using wetting force and wetting angle. Practical demonstrations and discussion.